Hong Kong Changshen Trading Co., Ltd.

Hong Kong Changshen Trading Co., Ltd.Hong Kong Changshen Trading Co., Ltd.Hong Kong Changshen Trading Co., Ltd.

Hong Kong Changshen Trading Co., Ltd.

Hong Kong Changshen Trading Co., Ltd.Hong Kong Changshen Trading Co., Ltd.Hong Kong Changshen Trading Co., Ltd.
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    • ABOUT US
    • Etched Glass
    • Wafer‌ Glass
    • Wafer & Ingot
    • ITO GALSS
    • Specialty ink
    • Vacuum mixer
    • Glass Processing
    • Contact Us
HOME
  • ABOUT US
  • Etched Glass
  • Wafer‌ Glass
  • Wafer & Ingot
  • ITO GALSS
  • Specialty ink
  • Vacuum mixer
  • Glass Processing
  • Contact Us
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Wafer‌ Glass Products

Wafer glass components are essential in modern precision optical packaging. Leveraging semiconductor manufacturing processes, conventional glass optics are transformed into wafer form, enabling miniaturization and high integration. These substrates are primarily applied in 3D imaging, AR displays, and mobile imaging systems.

Product categories include OLPF substrates, heat dissipation plates, wavelength plates, blue glass, and 6–8 inch wafer substrates. As a core material in electronics and optoelectronics, our wafer glass products deliver stable performance and high reliability, supporting diverse industrial applications.

Our products are recognized by domestic clients and international customers in Russia, Japan, and other regions, and we continue to strengthen our presence in the global market.

Various glass substrate

• Material: Corning EAGLE XG, Corning Gorilla, Borofloat 33, D263 glass, Irico alkali-free glass, BK7,Sodalime glass, Fused silica, quartz or other equivalent glass 

•Available size: diameter 100mm, 150mm, 200mm, 300mm or customized sizes

•Available thickness: customized 

•Application: Semiconductor, MEMS, sensor, Optical communications, silicon wafer bonding, CCD/CMOS, IC packaging, wafers, substrates, and optical components

Optical Low-Pass Filter (OLPF)

•  Function: Optical Low-Pass Filter (OLPF) Substrate — primarily integrated into imaging sensors to suppress high-frequency signal components, thereby eliminating moiré artifacts and chromatic aberrations (false color).

• Applications: Digital camera imaging modules, Industrial CMOS/CCD sensor packaging.


Heat Dissipation Plate

• Function:  engineered to provide efficient heat conduction and dissipation during high-speed imaging and high-luminance projection in image sensors or projector light sources. This prevents semiconductor chips from thermal overload, safeguarding device integrity and maintaining optimal image quality.

• Applications: LCD / LCOS projection systems, High-power laser diode modules,Advanced smartphone camera assemblies.


Waveplate/Retarder

Photomask Substrates

• Function:   precisely engineered to modify the polarization state of incident light beams, such as converting linearly polarized light into circularly polarized light, thereby enhancing optical system performance.

• Applications: Imaging systems for reflected light control and enhanced sharpness; widely adopted in AR/VR diffractive waveguide displays.


Blue Glass

Photomask Substrates

Photomask Substrates

• Function:   Blue Glass designed to absorb infrared radiation while maintaining high visible-light transmittance and accurate color reproduction, effectively mitigating the “redshift” phenomenon in imaging systems.

• Applications: Infrared filters for smartphone camera modules, Infrared filters for digital camera imaging systems.



Photomask Substrates

Photomask Substrates

Photomask Substrates

• Supporting both quartz glass and soda-lime glass materials, we provide a wide range of photomask substrates. Precision specifications are fully customizable, with substrate fabrication tailored to customer requirements.

• Application:Semiconductor Fabrication ,Flat-Panel Display Manufacturing ,MEMS Devices, Optical Components , Advanced Lithography (EUV)




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